Georgia Tech Consortium on Integrated Approach to Power Delivery for Electronic Systems

Moore’s law has been the driver for the semiconductor industry for more than four decades which has led to phenomenal transistor density within the chip, as shown in Figure 1. Since the mid-1990s, with the emergence of mobile phones and other consumer devices, package level integration has increased significantly as well. Sometimes referred to as More than Moore integration, these advances have led to the miniaturization of packages, integration of components into the package, miniaturization of components and introduction of new materials, leading to an increase in the system component density outside the chip, as shown in Figure 1. A combination of Moore (IC) and More than Moore (package) scaling has led to the shrinking of the size of electronic systems over the last two decades, and this trend is expected to continue in the future. Georgia Tech has been in the fore front for both Moore and More than Moore scaling technologies.